Part Number Hot Search : 
103M1 KCA323EA PY1101F PY1101F 425F3XHM PE42820 D70F3033 6050G
Product Description
Full Text Search
 

To Download STP50NE08 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  STP50NE08 n - channel enhancement mode " single feature size ? " power mosfet n typical r ds(on) = 0.020 w n exceptional dv/dt capability n 100% avalanche tested n low gate charge at 100 o c n application oriented characterization description this power mosfet is the latest development of sgs-thomson unique "single feature size ? " strip-based process. the resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility. applications n high current, high speed switching n solenoid and relay drivers n motor control, audio amplifiers n dc-dc & dc-ac converters n automotive environment (injection, abs, air-bag, lampdrivers, etc.) internal schematic diagram march 1998 1 2 3 to-220 absolute maximum ratings symbol parameter value unit v ds drain-source voltage (v gs = 0) 80 v v dgr drain- gate voltage (r gs = 20 k w ) 80 v v gs gate-source voltage 20 v i d drain current (continuous) at t c = 25 o c50a i d drain current (continuous) at t c = 100 o c35a i dm ( ) drain current (pulsed) 200 a p tot total dissipation at t c = 25 o c150w derating factor 1 w/ o c dv/dt ( 1 ) peak diode recovery voltage slope 6 v/ns t stg storage temperature -65 to 175 o c t j max. operating junction temperature 175 o c ( ) pulse width limited by safe operating area ( 1 ) i sd 50 a, di/dt 300 a/ m s, v dd v (br)dss , t j t jmax type v dss r ds(on) i d STP50NE08 80 v <0.024 w 50 a 1/8
thermal data r thj-case rthj-amb r thc-sink t l thermal resistance junction-case max thermal resistance junction-ambient max thermal resistance case-sink typ maximum lead temperature for soldering purpose 1 62.5 0.5 300 o c/w oc/w o c/w o c avalanche characteristics symbol parameter max value unit i ar avalanche current, repetitive or not-repetitive (pulse width limited by t j max, d < 1%) 50 a e as single pulse avalanche energy (starting t j = 25 o c, i d = i ar , v dd = 50 v) 300 mj electrical characteristics (t case = 25 o c unless otherwise specified) off symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 m a v gs = 0 80 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating v ds = max rating t c = 125 o c 1 10 m a m a i gss gate-body leakage current (v ds = 0) v gs = 20 v 100 na on ( * ) symbol parameter test conditions min. typ. max. unit v gs(th) gate threshold voltage v ds = v gs i d = 250 m a 234v r ds(on) static drain-source on resistance v gs = 10v i d = 25 a 0.020 0.024 m w i d(on) on state drain current v ds > i d(on) x r ds(on)max v gs = 10 v 50 a dynamic symbol parameter test conditions min. typ. max. unit g fs ( * ) forward transconductance v ds > i d(on) x r ds(on)max i d =25 a 20 35 s c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds = 25 v f = 1 mhz v gs = 0 3850 480 105 5100 650 140 pf pf pf STP50NE08 2/8
electrical characteristics (continued) switching on symbol parameter test conditions min. typ. max. unit t d(on) t r turn-on time rise time v dd = 40 v i d = 25 a r g =4.7 w v gs = 10 v (see test circuit, figure 3) 37 95 50 130 ns ns q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 64 v i d = 50 a v gs = 10 v 85 19 28 110 nc nc nc switching off symbol parameter test conditions min. typ. max. unit t r(voff) t f t c off-voltage rise time fall time cross-over time v dd = 64 v i d = 50 a r g =4.7 w v gs = 10 v (see test circuit, figure 5) 12 30 50 17 40 68 ns ns ns source drain diode symbol parameter test conditions min. typ. max. unit i sd i sdm ( ) source-drain current source-drain current (pulsed) 50 200 a a v sd ( * ) forward on voltage i sd = 50 a v gs = 0 1.5 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 50 a di/dt = 100 a/ m s v dd = 30 v t j = 150 o c (see test circuit, figure 5) 100 400 8 ns nc a ( * ) pulsed: pulse duration = 300 m s, duty cycle 1.5 % ( ) pulse width limited by safe operating area safe operating area thermal impedance STP50NE08 3/8
output characteristics transconductance gate charge vs gate-source voltage transfer characteristics static drain-source on resistance capacitance variations STP50NE08 4/8
normalized gate threshold voltage vs temperature source-drain diode forward characteristics normalized on resistance vs temperature STP50NE08 5/8
fig. 1: unclamped inductive load test circuit fig. 3: switching times test circuits for resistive load fig. 2: unclamped inductive waveform fig. 4: gate charge test circuit fig. 5: test circuit for inductive load switching and diode recovery times STP50NE08 6/8
dim. mm inch min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 d1 1.27 0.050 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.067 f2 1.14 1.70 0.044 0.067 g 4.95 5.15 0.194 0.203 g1 2.4 2.7 0.094 0.106 h2 10.0 10.40 0.393 0.409 l2 16.4 0.645 l4 13.0 14.0 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.2 6.6 0.244 0.260 l9 3.5 3.93 0.137 0.154 dia. 3.75 3.85 0.147 0.151 l6 a c d e d1 f g l7 l2 dia. f1 l5 l4 h2 l9 f2 g1 to-220 mechanical data p011c STP50NE08 7/8
information furnished is believed to be accurate and reliable. however, sgs-thomson microelectronics assumes no responsa bility for the consequences of use of such information nor for any infringement of patents or other rights of third part ies which may results from its use. no license is granted by implication or otherwise under any patent or patent rights of sgs-thomson microelectronics. specifications mentioned in this publication are subject to change without notice. this publication su persedes and replaces all information previously supplied. sgs-thomson microelec tronics products are not authorized for use as critical components in life support devices or systems without express written approval of sgs-t homson microe lectonics. ? 1998 sgs-thomson microelectronics - printed in italy - all rights reserved sgs-thomson microelec tronics gr oup of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - morocco - the neth erlands - singapore - spain - sweden - switzerland - t aiwan - thailand - united kingdom - u.s.a . . . STP50NE08 8/8


▲Up To Search▲   

 
Price & Availability of STP50NE08

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X